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Bosch presentation at Interphex 2018 on medical device assembly trends and considerations

Bosch_presentation_device_assembly_interphex

Representatives from Bosch Packaging Technology will be at Interphex in New York City on April 17-19th at the Jacob Javits Convention Center to showcase their complete product line.

Part of Bosch’s presence at the show will include a technical session by two of the company’s representatives from the Moeller & Devicon division. This session will include a presentation of some of the latest trends and considerations for companies engaging in assembly projects for drug delivery devices (multi-dose pens and auto injectors, specifically).  The presentation will also include some considerations for partnership strategies, and methods of scaling up technologies from pre-clinical to commercialization phases, including dedicated and multiple product scenarios.

Presentation details:
Date: Wednesday, April 18th
Time: 3:15 PM – 4:00 PM
Location: The Technical Conference Stage 1, Booth 1076, Exhibit Hall

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