Bosch presentation at Interphex 2018 on medical device assembly trends and considerations

Bosch_presentation_device_assembly_interphex

Representatives from Bosch Packaging Technology will be at Interphex in New York City on April 17-19th at the Jacob Javits Convention Center to showcase their complete product line.

Part of Bosch’s presence at the show will include a technical session by two of the company’s representatives from the Moeller & Devicon division. This session will include a presentation of some of the latest trends and considerations for companies engaging in assembly projects for drug delivery devices …More





Bosch to Present on Aerosol Generation at the Point of Fill at Interphex 2018

Bosch Packaging Technology is pleased to announce the publication of Part 1 of its recent aerosol generation at the point of fill characterization study in poster format at the upcoming Interphex 2018 conference to be held in New York City on April 17-19.

A comprehensive barrier system suitability evaluation based on the products and processes involved includes an assessment of product and operator safety risk attributable to aerosolization at the point of fill. The audience at Interphex will …More


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